Blind hole depth measurement
Category:
Description
Measurement requirements
Scan the three-dimensional surface of the metal sheet and measure the depth of the blind holes on its surface.
Overview of Key Features
1. Non-contact measurement, integrated design
2. 3D morphology scanning, multi-functional data processing
3. Precise measurement applicable to various materials
4. Simple to use and easy to assemble and disassemble.
5. Fast scanning speed and high positioning accuracy
6. Repeatability accuracy guaranteed from ±0.5 to ±1 μm
7. High stability and strong anti-interference capability


Measurement results
The blind hole depth is approximately 33 μm.
Address the issues currently existing in measurement devices.
1. There are certain requirements for the measurement materials.
2. Contact measurement causes damage to the measured material.
3. Small measurement range, uncertain positioning, and difficult determination.
4. Slow measurement speed, low accuracy, and large measurement errors.
5. Complex structure, high cost
Address: Room 204, Building D2, Chuangyi Workshop, No. 6000 Shenzhuan Highway, Songjiang District, Shanghai市
Copyright © 2025 Sichen Optoelectronics Technology (Shanghai) Co., Ltd. Privacy Policy


















Channel
Douyin Account
Zhihu