Visual Spectral Confocal Displacement Sensor mainly uses the principle of coaxial detection and the chromatic aberration deviation of the lens.

What is the principle of the chromatic aberration of the lens?

That is to say, if a beam of composite light is injected into the chromatic lens, the light of different wavelengths (red, orange, yellow, green, blue, violet, etc.) will not be focused on one point, but the focused point will be Distributed from short to long and from near to far, this also becomes spectral chromatic aberration.

What is coaxial detection?

It adds a convex lens at the end, so that the focal points of light of different wavelengths are distributed on one axis, and the reflected light will be reflected back along this axis. Let's talk about how it implements detection.

According to these two principles, the visual spectral confocal displacement sensor uses a special dispersive lens. According to the distance between the measured object and the lens, the light of exactly one wavelength will be focused on the surface of the measured object, and along the Most of the light of other wavelengths cannot enter the spectrometer because it is out of focus on the surface of the measured object. The spectrometer decodes the powerful wavelengths of light to calculate the distance between the lens and the object being measured.

The visual spectral confocal displacement sensor has the advantages of non-contact measurement, large measurement angle, and little influence by the characteristics of the object, and can basically solve all materials, colors, shapes and reflections. For example, it can be used to measure the thickness of transparent objects, as well as contour, displacement, height, 2d3d surface arc scanning, thickness measurement of opaque objects, vibration measurement, deep hole, liquid level measurement, micro groove, flatness measurement, etc.

In the mobile phone industry, such as curved cover glass detection, mobile phone motherboard detection, button size or height detection, chip detection, camera module detection, mobile phone camera module detection, etc.

Semiconductor industry, chip lead flatness inspection, wafer depth and thickness inspection.

Glass measurements, such as thickness, radian, etc.